The MCM ITP (Materials and Components for Missiles, Innovation and Technology Partnership) is a UK MoD and DGA sponsored research fund open to all Anglo-French companies and Academic Institutions.

Domain 8: Materials and Electronics


The Materials Domain of the MCM ITP covers a broad range of technologies which are fundamental to the overall operational capability of future missile systems and supporting capabilities in modelling & simulation, lifing and low cost manufacturing.

The global aim is to prepare future airframe solutions in accordance with missile systems’ technical objectives:

  • high speed, long range, stealth, increased life duration, Life Cycle Management, multi-functionality of airframe
  • low mass and high compactness munitions facilitating  access to platforms
  • development of cost effective capabilities for “development and manufacture”

The domain aims to develop innovative techniques that complement the emergent technologies developed across the programme and that enhance the capability of missile systems’ solutions through their utilisation. The perimeter of this domain includes the following technologies.

  • High Temperature Materials (C-C, C-SiC, CMCs ….)
  • Joining Methods for CMCs/Metals
  • Metal Matrix Composites (MMCs)
  • Smart Materials, Structures and Devices
  • Meta-materials
  • Improved Structural Design – Modelling and Simulation
  • Improved lifing
  • Drag reduction methods for improved performance (i.e enhanced range, persistence or endurance)
  • Low Observable Materials


MBDA F leads the Electronics Sub-Domain in domain 8 “Materials and Components for Missiles” in the frame of “Innovation and Technology Partnership”. The Domain is seeking early-stage technologies (TRL 1-4) for future electronics in guided weapons. A major area is to explore and demonstrate how innovative and emerging technologies will allow enhanced capabilities for the next generation of weapon systems by providing safe and airworthy features at the lowest possible costs.

Topics considered within the electronics sub-domain include:

  • Packaging & assembly technologies (3D packaging, Printed electronics, SIP, SoC …).
  • Electrical power management (New energy source, high efficiency converter,…).
  • Innovative data transmission technologies (High data rate, Contactless,…).
  • Safety electronic architecture (electronics and software).
  • Electronic reliability & health features.
  • Emerging technologies (Micro technologies, Nano-materials, Nano-electronics…).
There are two ways to find out more about Domain 8: Materials and Electronics
choice one
Watch the video on MCM ITP's missile research programme.
choice two
Contact us with specific questions, or to be kept up to date with the programme.